Category. Description, Dual Channel Synchronous-rectified Buck Mosfet Driver. Company, Intersil Corporation. Datasheet, Download HIP datasheet. Quote. HIP Datasheet PDF Download – Dual Channel Synchronous-Rectified Buck MOSFET Driver, HIP data sheet. HIP datasheet, HIP circuit, HIP data sheet: INTERSIL – Dual Channel Synchronous-Rectified Buck MOSFET Driver,alldatasheet, datasheet.
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This drive-voltage flexibility provides the advantage of optimizing applications involving trade-offs between switching losses and conduction losses. Each driver is capable of driving a pF load with hip66602 30ns propagation delay and 50ns transition time. This device implements bootstrapping on the upper gates with only a single external capacitor required for each power channel.
8205a ic datasheet pdf
These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. See Tech Brief TB for details. Connect this pin to the PWM output of the controller. GND Pin 3 Bias and reference ground. All signals are referenced to this node.
HIP – Electronics inventory – Shenzhen Mingjiada Electronic Co., LTD.
Place a high quality bypass capacitor from this pin to GND. To prevent forward biasing an internal diode, this pin should be more positive then PVCC during converter start-up.
These pins also provide a return path for the upper gate drive. The upper and lower gates are held low until the driver is initialized. The shutdown state is removed when the PWM signal moves outside the shutdown window.
Adaptive Shoot-Through Protection The hil6602 incorporate adaptive shoot-through protection to prevent upper and lower MOSFETs from conducting simultaneously and shorting the input supply.
This is done to generate the bootstrap refresh signal. PHASE continues to be monitored during the lower gate rise time. Both upper and lower gates are then held low until the next rising edge of the PWM signal. Internal Bootstrap Device Both drivers feature an internal bootstrap device.
The bootstrap capacitor can be chosen from the following equation: We will assume a mV droop in drive voltage over the PWM cycle. We find that a bootstrap capacitance of at least 0. The next larger standard value capacitance is hi6p602.
Calculating the power dissipation in the driver for a desired application datssheet critical to ensuring safe operation. Improvements in thermal transfer may be datasgeet by increasing the PC board copper area around the HIP Adding a ground pad under the IC to help transfer heat to the outer peripheral of the board dtaasheet help. Also keeping the leads to the IC as wide as possible and widening this these leads as soon as possible to further enhance heat transfer will also help.
When designing the driver into an application, it is recommended that the following calculation be performed to ensure safe operation at the desired frequency for the selected MOSFETs. The total chip power dissipation is approximated as: The base circuit for characterizing the drivers for different loading profiles datashete frequencies is provided.
CU and CL are the upper and lower gate load capacitors. The bootstrap capacitor value in the test circuit is 0. The power dissipation approximation is datahseet result of power transferred to and from the upper and lower gates. But, the internal bootstrap device also dissipates power on-chip during the refresh cycle. While the bootstrap device conducts, a current path is formed that refreshes the bootstrap capacitor.
Therefore, the refresh power required by the bootstrap capacitor is equivalent to the power used to charge the gate capacitance of the upper MOSFETs. Figure 3 is the same as Figure 2 except the capacitance is increased to 3nF. Frequency is held constant while the gate capacitors are varied from 1nF to 5nF. Mold flash, protrusion and gate burrs shall not exceed 0. Interlead flash and protrusions shall not exceed 0.
The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. Terminal numbers are shown for reference only. Converted inch dimensions are not necessarily exact.
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Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is datazheet by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties hiip6602 may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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